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MPI Corporation: Tiny PICs with Huge Impact: Meeting the Challenges of Photonic Integrated Circuits Testing for Next-Generation Networks

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FREE WEBINAR


Tiny PICs with Huge Impact:


Meeting the Challenges of Photonic Integrated Circuits Testing for Next-Generation Networks


Optical testing at the wafer level is currently a major bottleneck in component manufacturing due to tighter tolerances in optical testing compared to electrical testing, accounting for 80 percent of the test and assembly cost of the final product.


In this webinar, you will discover how the MPI PIC testing solution addresses market challenges, making wafer testing faster, scalable, and more reliable, ultimately improving speed-to-market for component manufacturers. This topic shines a light on photonic wafers as critical building blocks for next-generation networks, laying the groundwork for 5G deployment and high-speed data centers.


On-Demand Video Coming Soon!


More about "Tiny PICs with Huge Impact" & FAQ


How much does this Tiny PICs with Huge Impact training cost?

This training is 100% free!


What topics will you cover?

This webinar will teach you about PIC testing solutions which address market challenges, making wafer testing faster, scalable, and more reliable, ultimately improving speed-to-market for component manufacturers.



About the Presenter


Sebastian Giessmann

Sebastian Giessmann, Product Marketing Manager @MPI Corporation

Sebastian received his degree in Electrical Engineering from the Dresden University of Applied Science. He has held various positions in R&D, application support and product management in the semiconductor test industry. Currently he is responsible for probe systems product marketing at MPI Corporation and with specialization in silicon photonics testing.





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