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Register for the EMI and Power Seminar - Check out the Various Dates and Locations!

2019-01-01



New Techniques for Testing Modern Power Supply Designs and Solving EMI Challenges


Learn from the Tektronix experts, receive a complimentary lunch, and have a chance to Test Drive the newest products on the market!



IoT and low power devices are expected to exceed 20 billion units by 2020. Many of these devices will be wearables, portable medical devices, and battery-operated sensor/transmitters requiring long battery life. Designers need to be able to determine the total power that the end device will consume and how the device can be efficiently powered.

Wide Bandgap designs such as SiC and GaN are now being used in demanding applications such as automotive and RF communications because they can operate at higher frequencies, voltage and temperatures with lower power loss making these devices preferred in power converters over traditional Silicon however this comes with several important considerations. Benefits of the half bridge technology can only be realized when all stages of the circuit are properly designed and optimized to ensure measured results agree with expected results.

Did you know that 50% of projects fail EMI/EMC testing the first time? This can be due to a failure in applying EMC principles, lack of knowledge, unpredicted interactions among circuit elements, or using non-compliant modules into the final product.

• New methods on how to characterize storage systems
• How to precisely measure the power and load profiles
• New tools for defining the characteristics of the Wide Bandgap device
• Take the mysteries out of EMI/EMC test setup
• Test to US, EU and worldwide EMI standards
• Debug EMI problems by localizing the source of emissions
• Compile a complete pre-compliance test solution for conducted and radiated emissions




DATES AND LOCATIONS:

Wednesday, April 3
Houston Marriott Westchase
2900 Briarpark Drive

Houston, TX 77042
Click here to Register

Wednesday, April 10
Novotel Montreal Airport
2599 boulevard Alfred Nobel
Ville St-Laurent, QC, H4S 2G1
Click here to Register

Thursday, April 11
Hilton Garden Inn Toronto/Markham
300 Commerce Valley Dr. E.
Thornhill, ON, L3T 7X3
Click here to Register

Tuesday, June 25
Austin, TX
Click here to Pre-Register


Agenda:


9:30 am to 10:00 am – Registration and Continental Breakfast
10:00 am to 11:00 am – Testing IOT and Low Power Devices
11:00 am to 12:00 pm – Overcoming Testing Challenges of Wide Bandgap Devices
12:00 pm to 1:00 pm – Complimentary Luncheon and Hands-on Demos
1:00 pm to 3:00 pm – EMI Pre-Compliance

Luncheon and product fair – Test drive the following new products from Tektronix

• Oscilloscopes - 5 Series MSO, 6 Series MSO & MDO4000C
• IOT Battery testing solutions - DMM7510, 2281S Battery Simulator & 2450 SMU
• Power Testing solutions – IsoVu Isolated Probe, TPR4000 Power Rail Probes
• Advanced arbitrary waveform generation and real-time monitoring with the new AFG31K
• EMC pre-compliance & Real time spectrum analysis with the RSA500 series





About the Presenters for Canada:


Seshank Malap, Market Segment Lead – Power Solutions
For past 9 years, Seshank has specialized in power solutions strategy, marketing, applications and testing. Before Tektronix, Seshank has held a variety of apps, research and design roles at Toshiba International Corporation, NXP Semiconductors and Lear Corporation. His experience involves working on power semiconductors, UPS systems, automotive battery chargers and automotive motor drives.

Xiao Li, Product Line Application Engineer
Xiao Li is an Application Engineer for Wideband solution business unit at Tektronix. He joined Tektronix in 2012, where he specializes in frequency domain tests and measurements. Xiao received his Ph.D. from Portland State University, and has a broad background in the areas of wireless communication and signal processing.




About the Presenters for USA:


Pat Hensley is a business development manager for Automotive and Energy at Tektronix. He holds degrees in engineering and international business and has over 34 years of experience in sales and business development in the semiconductor test and measurement space.

Bill Byrom is an RF applications Engineer for Tektronix. He holds a degree in Electrical Engineering, is a member of IEEE & the IEEE P1765 Standard Working Group on EVM. He has over 40 years of experience in the industry with a heavy focus on RF test equipment.





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 EMI, Seminar, Power Electronics, Tektronix

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